Exhibitor Presentations

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Tuesday, March 18, 2025
1:30 PM - 2:00 PM ET
EX - 48V Architecture for Automotive
Location: Expo Theater 2
Exhibitor Presenter: Aravind Mathsyaraja, MS Engineering (he/him/his) – STMicroelectronics
Presented By
1:30 PM - 2:00 PM ET
EX - A State-of-the-art Heterogeneous Core Design to Further Boost Your Power Density
Location: Level Three, A313
Exhibitor Presenter: Justin Lee – ACME Electronics
Presented By
1:30 PM - 2:00 PM ET
EX - AmberSemi -the Generational Power Architectures Paradigm shift: Bringing unique digital power solutions to the market that solve the entire power ecosystem challenge.
Location: Level Three, A316
Speaker: Thar Casey, CEO – Amber Semiconductor, Inc. (AmberSemi)
Presented By
1:30 PM - 2:00 PM ET
EX - Delivering breakthrough performance at real-world conditions
Location: Expo Theater 4
Exhibitor Presenter: Ugo Ghisla – Wolfspeed
Presented By
1:30 PM - 2:00 PM ET
EX - High Efficiency Transformer-coupled VR Solution for AI Chips
Location: Level Three, A311
Exhibitor Presenter: Wei Tang, Ph D. (he/him/his) – Delta Electronics
1:30 PM - 2:00 PM ET
EX - Materials Technology for Flux-Free Soldering Applications in Power Electronics
Location: Level Three, A312
Exhibitor Presenter: Ryan W. Mayberry – Indium Corporation
Presented By
1:30 PM - 2:00 PM ET
EX - Multi-Phase Controller and Power Stage for AI Server and Graphic Card Power
Location: Level Three, A314
Exhibitor Presenter: Rhys Philbrick – Alpha & Omega
Presented By
1:30 PM - 2:00 PM ET
EX - Nanocrystalline Soft Magnetic Alloy Powder Produced by SWAP
Location: Level Three, A315
Exhibitor Presenter: Mayu Watanabe
Presented By
1:30 PM - 2:00 PM ET
EX - Powering Innovation: The Next Generation of 650 V CoolMOS ™ 8, 750 V CoolSiC™ G2 and Top Side Cooling Q-DPAK technology
Location: Expo Theater 3
Exhibitor Presenter: Zsolt Gyimesi, MSc, MBA – Infineon
Presented By
1:30 PM - 2:00 PM ET
EX - Understanding EMI and Noise Mitigation Methods
Location: Expo Theater 1
Exhibitor Presenter: Vidal Gonzalez – Wurth Elektronik
Presented By
2:15 PM - 2:45 PM ET
EX - Accurate High-Fidelity Precision Testing Solutions for Tomorrow’s Power Systems and Power Integrity Applications
Location: Level Three, A315
Exhibitor Presenter: STEVEN M. SANDLER – www.picotest.com
Presented By
2:15 PM - 2:45 PM ET
EX - Advancing Power Solutions Using TLVR with High-Current Multiphase Dual Inductors
Location: Expo Theater 2
Exhibitor Presenter: Manish Khandelwal – Wurth Elektronik
Presented By
2:15 PM - 2:45 PM ET
EX - Cost-Effective, Highly-Efficient Power Delivery Across the Load Range
Location: Expo Theater 1
Exhibitor Presenter: Andy Smith
Presented By
2:15 PM - 2:45 PM ET
EX - Designing Low Loss Inductors with Next-Generation Powder Core Materials
Location: Level Three, A311
Exhibitor Presenter: John Noble – Magnetics Division of Spang & Co.
Presented By
2:15 PM - 2:45 PM ET
EX - Expanding the LV100 lineup to include 3.3kV SiC SBD-Embedded MOSFETs (Unifull™) and other next generation technologies
Location: Expo Theater 4
Exhibitor Presenter: Michael Rogers – Mitsubishi Electric US Inc.
Presented By
2:15 PM - 2:45 PM ET
EX - GaN-based Solutions for Auxiliary Power Supplies and Battery Chargers
Location: Level Three, A316
Exhibitor Presenter: Rosario Attanasio (he/him/his) – STMicroelectronics
2:15 PM - 2:45 PM ET
EX - MCU-Driven GaNevo: Simplifying Power Module
Location: Level Three, A313
Exhibitor Presenter: Diana Ahmed – Chip-GaN Semiconductor
Presented By
2:15 PM - 2:45 PM ET
EX - Perpetuum Mobile – OR Pushing The Efficiency & Power Density Limits of Low-Power Flyback Converters
Location: Expo Theater 3
Exhibitor Presenter: Laszlo Balogh – Texas Instruments
Presented By
2:15 PM - 2:45 PM ET
EX - Simulating the Conducted EMI Performance of a Switching Power Supply
Location: Level Three, A312
Exhibitor Presenter: Andrija Stupar – SIMPLIS Technologies
Presented By
2:15 PM - 2:45 PM ET
EX - Testing Solutions for AI Server Power and BBU
Location: Level Three, A314
Exhibitor Presenter: Jonathan McCallie (he/him/his) – Chroma
Presented By
3:00 PM - 3:30 PM ET
EX - Advancing Power Electronics with Nexperia’s 650 V IGBT technology: High Efficiency Solutions for Industrial and Automotive Applications
Location: Expo Theater 4
Exhibitor Presenter: Arthur Gonsky – Nexperia
Presented By
3:00 PM - 3:30 PM ET
EX - Automotive Grade 650V GaN Devices
Location: Level Three, A313
Exhibitor Presenter: Kengo Ohmori, MS (he/him/his) – ROHM Semiconductor USA, LLC
Presented By
3:00 PM - 3:30 PM ET
EX - Better than BOPP: Unlocking higher temperatures with low loss in nanolayered polymer capacitor films
Location: Level Three, A314
Exhibitor Presenter: Mason Wolak – Peak Nano Films
Presented By
3:00 PM - 3:30 PM ET
EX - Comprehensive Power Delivery Solution for Modern AI Data Centers
Location: Expo Theater 1
Exhibitor Presenter: Paolo Sandri – STMicroelectronics
Presented By
3:00 PM - 3:30 PM ET
EX - Faster than Realtime Power Converter & Motor Drive System Simulations with Trained Physics Models for System Cost Optimization
Location: Level Three, A311
Exhibitor Presenter: Albert W. Dunford – Altair Engineering
Presented By
3:00 PM - 3:30 PM ET
EX - Simplifying Loss Simulations Using a Self-Service PLECS Model Generator
Location: Expo Theater 3
Exhibitor Presenter: Didier Balocco, PhD (he/him/his) – onsemi
Presented By
3:00 PM - 3:30 PM ET
EX - Smarter, Smaller, Simpler: Advanced IC Innovations that Streamline Designs for Power Systems
Location: Expo Theater 2
Exhibitor Presenter: Shigeki Kajitani – Nisshinbo Micro Devices
Presented By
3:00 PM - 3:30 PM ET
EX - Soitec’s Power-SOI Based Gate Drivers Shaping the Future of Wide-bandgap (WBG) Devices for High Switching Frequency Power Conversion Applications
Location: Level Three, A312
Exhibitor Presenter: Alex Lim (he/him/his) – Soitec
Presented By
3:45 PM - 4:15 PM ET
EX - 2kV SiC Drives Electrification Through Speed and Simplicity
Location: Level Three, A311
Exhibitor Presenter: Paul Drexhage – Semikron Danfoss
Presented By
3:45 PM - 4:15 PM ET
EX - Advances in SiC MOSFET device and packaging technology from ROHM
Location: Expo Theater 2
Exhibitor Presenter: Ming Su, PhD – ROHM Semiconductor USA, LLC
Presented By
3:45 PM - 4:15 PM ET
EX - AmberSemi -the Generational Power Architectures Paradigm shift: Bringing unique digital power solutions to the market that solve the entire power ecosystem challenge.
Location: Expo Theater 1
Exhibitor Presenter: Thar Casey, CEO – Amber Semiconductor, Inc. (AmberSemi)
Presented By
3:45 PM - 4:15 PM ET
EX - High voltage DC for data centers: overview and challenges
Location: Level Three, A315
Speaker: Sheng-Yang Yu, PhD – Texas Instruments, Inc.
Presented By
3:45 PM - 4:15 PM ET
EX - Industry First - 3 & 4-level, Buck Converter for Fast Charging
Location: Expo Theater 4
Exhibitor Presenter: Laurence McGarry, BEng Hons MBA – pSemi Murata
Presented By
3:45 PM - 4:15 PM ET
EX - Next-Generation SiC Power MOSFETs for Automotive Applications
Location: Level Three, A312
Exhibitor Presenter: Steffen Beushausen – Robert Bosch GmbH
Presented By
3:45 PM - 4:15 PM ET
EX - Reliability of HTV150A Films for High Temperature and High Voltage Capacitors for AC-DC Inverter Applications
Location: Level Three, A314
Exhibitor Presenter: Adel Bastawros, PhD (he/him/his) – SABIC
Presented By
3:45 PM - 4:15 PM ET
EX - The Cleverscope CS1202 Isolated Transistor Digitizer
Location: Level Three, A313
Exhibitor Presenter: Bart Schroder – Cleverscope
Presented By
3:45 PM - 4:15 PM ET
EX - West Coast Magnetics
Location: Expo Theater 3