Presentation Description: The need for scalable, reliable and power dense systems has led into the development of SEMITRANS 20 module platform. This module utilizes the latest packaging technologies such as chip sintering, silicon nitride substrates and AlCu bondswires and is already in mass production with Si chips. The packaging technology is also well suited for next generation chips, notably SiC, due to its low inductance, optimized design and superior layout. This presentation demonstrates how the module’s capabilities can be fully utilized by implementing 2kV SiC chips. This new SiC chips increase power density and simplify design efforts for next generation systems that require 1500V operating DC bus voltages. Previous works have covered the construction and layout of the module in detail. In this work we present experimental results to demonstrate the dynamic performance of a one milliohm module and the viability of the SiC module.
