Presentation Description: The ubiquitous proliferation of Artificial Intelligence(AI) and cloud services in our day to day lives has brought about an explosive growth in high performance computing. This has resulted in the use of more powerful and larger microprocessors that consume unprecedented levels of energy. Simultaneously, as the needs for high quality high power is increasing the physical space on boards becomes a challenge with the competing needs between GPU/CPUs and peripheral devices. This paper presents Saras embedded STile advanced technology that addresses these issues and provides a versatile and customizable solution. At the core of the STile is the polymer aluminum solid electrolytic capacitor and the inductor with magnetic core embedded into the substrate package. The capacitor and inductor are the building blocks of the STile with customizable layout. We report a high effective capacitor density at high voltage rating of 4V. Similarly, inductors are laid out in an optimized manner to realize a multi power domain and current multiphase at the package substrate level. This technology enables vertical power delivery(VPD) and integrated voltage regulator(IVR) by bringing high performing capacitors and inductors closer to the point of load.
