Presentation Description: This presentation discusses the challenges associated with measuring the dynamic characterization of a wide-bandgap (WBG) power semiconductor bare chip. It then presents technologies to address these challenges and enable accurate evaluation, It will provide a new measurement method that is beneficial for WBG power device engineers and power module design engineers.
.jpg "Yu Watanabe, MA (he/him/his) photo")
.jpg "Takamasa Arai (he/him/his) photo")