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Technical Lecture

Power Modules / High Density Design

T24.3 - A New Subassembly Concept for Enhanced Heat Dissipation and Reliability of Power Module

Wednesday, March 19, 2025
2:10 PM – 2:30 PM ET
Location: Level Three, A316
This paper introduces a new subassembly concept aimed at improving heat dissipation and reliability in Silicon Carbide (SiC) modules. The subassembly, which integrates multiple SiC chips into a single plate and covers them with mold resin, is proposed as a versatile solution for SiC modules that can be adapted to various module forms. The study focuses on a module shape that reflects a de facto standard in the xEV market, where there is a high demand for replacement from Silicon (Si) to SiC. The effectiveness of the subassembly in terms of heat dissipation was confirmed through simulation. Furthermore, a prototype module was manufactured and its performance was evaluated through power cycle testing. The results of the simulations showed a 7.7% thermal advantage of the subassembly module over conventional modules. The power cycle test revealed minimal internal degradation of the subassembly, even in the weak Aluminum (Al) layer. However, the study also identified a need for improvements in the lower joint of the subassembly, which will be the focus of future work.