T37.5 - A Scalable Dual-Orthogonal-Cooling Packaging Concept for Parallel-Series SiC Chips

Thursday, March 20, 2025

11:30 AM – 11:50 AM ET

Location: Level Three, A301

Technical Lecture Presenter(s)

Ekaterina Muravleva

University of Nebraska-Lincoln

Presentation Paper

Co-Author(s)

YA

Youssef Abotaleb

University of Nebraska-Lincoln
BA

Blake Anderson

University of Nebraska-Lincoln
JH

Jerry Hudgins

University of Nebraska-Lincoln
JW

Jun Wang, PhD

University of Nebraska–Lincoln
Zichen Zhang

Virginia Tech
Boyi Zhang

Delta Electronics (Americas) Ltd.

Existing high-frequency vertical devices modules with isolated substrates typically attach the WBG/UWBG dies on the substates. This configuration becomes a constraint for high-power modules incorporating many dies in series and parallel and sophisticated topologies. This digest proposes a new packaging concept that allows the dies to be placed perpendicular to the substrates using a novel switch bar structure. The switch bars conduct high currents and serve as a heat spreader to enable orthogonal cooling (OC) through dual sides; meanwhile, contain power loops within the substrate ceramic layer for any topologies and minimize package footprint. The proposed OC packaging concept has been verified in FEA simulations concerning power loop inductance, E-field distribution, and thermal management. Prototype parts have been fabricated, and the packaging and testing results will be demonstrated in the full paper.