An innovative DC-Link Capacitor solution [1] for the Main Powertrain Inverter has been offered to the market as of July 2024. The innovation is sustained by the conjunction of four pillars: Modularity-Scalability; Design for application; Design for manufacturing; Standardization-Catalog product. After a brief review of these pillars already detailed in [1], this paper focus on the practical study of xEVCap at system level. The analysis is deployed in four major subject areas. The parasitics (ESL, ESR, … from single element to the effective ones at system level). 2nd area is the assembly and joint technologies to the busbar. 3rd area is the strategy for thermal decoupling between capacitor and power semiconductors without cooler. To conclude with the thermal integration with cooler and how the different elements interact under different temperatures. Everything supported by Ansys and CFD simulations, and with the construction of a demonstrator for laboratory testing. In addition to this, results of collaboration projects with external recognized parties, like power semiconductor and busbar suppliers.
