IS26 - Test & Measurements

Industry Session Chair(s)

• 

  Edward Jones, PhD (he/him/his)

  Infineon Technologies Austria AG
• MP

  Markondeyaraj Pulugurtha

  Florida International University

Student Session Assistant(s)

• 

  Tobias Zekorn, MSc (he/him/his)

  Integrated Analog Circuits and RF Systems at RWTH Aachen University

Presentations:

• 10:10 AM – 10:35 AM ET

  3rd generation power devices (WBG) measurement approach tips and guidelines
  

  Industry Session Presenter: Marcus Sonst (he/him/his) – Rohde & Schwarz GmbH & Co. KG

  Co-Author: Christian Schmidt – Rohde & Schwarz GmbH & Co. KG

  Co-Author: Mike Schnecker – Rohde & Schwarz GmbH & Co. KG
• 10:35 AM – 11:00 AM ET

  A Comprehensive Anti-Islanding Test Model Utilizing Hardware-in-the-Loop Technology for Power Solutions
  

  Industry Session Presenter: Brian Hsu – Rexgear

  Co-Author: Ecson Hsu – Rexgear

  Co-Author: Luis Veliz, BSEE – Rexgear
• 11:00 AM – 11:25 AM ET

  Comparing ZVS losses distribution of similar high performance GaN HEMTS
  

  Industry Session Presenter: Théo SIMON (he/him/his) – Wise integration

  Co-Author: Thanh Hai PHUNG – Wise integration

  Co-Author: Johan DELAINE – Wise integration

  Co-Author: Plinio C. F BAU, PhD – Wise integration

  Co-Author: Alain BAILLY – Wise integration
• 11:25 AM – 11:50 AM ET

  Dynamic characterization of a WBG power semiconductor bare chip
  

  Industry Session Presenter: Yu Watanabe, MA (he/him/his) – Solution Engineering Organization / Keysight Technologies Japan

  Co-Author: Ryo Takeda, MSEE – Keysight Technologies

  Co-Author: Takamasa Arai (he/him/his) – Keysight Technologies