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Technical Dialogue
Technical Dialogue Session

D11 - Power Converter Design, Packaging & Integration

Thursday, March 20, 2025
11:30 AM – 1:30 PM ET
Location: Level One, Hall A3

Presentations:

  • 11:30 AM – 1:30 PM ET
    Integrated 4-Level Dual-Phase Superimposed Quadratic Power Converter for High-Density Direct 48V/1V Conversion

    Technical Dialogue Presenter: Prosenjit Ghosh, PhD – University of Texas at Dallas

    Co-Author: Jin Woong Kwak – The University of Texas at Dallas

    Co-Author: D. Brian Ma – University of Texas at Dallas

    Co-Author: Fei Zhou (he/him/his) – The University of Texas at Dallas

  • 11:30 AM – 1:30 PM ET
    Compensation Method for Unbalance of the Multi-Channel Class E Power Amplifier using the Closed Loop Frequency Control

    Technical Dialogue Presenter: Kyungmin Lee, PhD – Samsung electronics

    Co-Author: Sungku Yeo – Samsung Electronics

  • 11:30 AM – 1:30 PM ET
    High Temperature Operation of Digital Gate Driver Integrated Into a Power Module

    Technical Dialogue Presenter: Kazuma Saiga (he/him/his) – Kyushu University

    Co-Author: Shohei Zaizen – Kyushu University

    Co-Author: Satoshi Nakano – Kyushu University

    Co-Author: Shigeru Kusunoki – Kyushu University

    Co-Author: Kiyoto Watabe – Kyushu University

    Co-Author: Katsuhiro Hata (he/him/his) – Shibaura Institute of Technology

    Co-Author: Makoto Takamiya – The University of Tokyo

    Co-Author: Shin-Ichi Nishizawa – Kyushu University

    Co-Author: Wataru Saito – Kyushu University

  • 11:30 AM – 1:30 PM ET
    Evaluation Index-Based Multiphysics Coupling Model and Analysis Methodology for High-Reliable Power Supply Module

    Technical Dialogue Presenter: Haoyu Wang – Tsinghua University

    Co-Author: Xuliang Wang (he/him/his) – Tsinghua University

    Co-Author: Yan Wang – Tsinghua University

    Co-Author: Xiaosen Liu – Tsinghua University

  • 11:30 AM – 1:30 PM ET
    Electrical Characterization of Modular 3D Packaging Assembled with Compressed Metal Foams

    Technical Dialogue Presenter: Omar Sanjakdar (he/him/his) – Univ. Grenoble Alpes, CEA-Liten, INES

    Co-Author: Paul Bruyere (he/him/his) – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, Grenoble, France

    Co-Author: Yvan Avenas – G2Elab

    Co-Author: Eric Vagnon – Ecole Centrale de Lyon, CNRS, Ampère, UMR5005, 69130 Ecully, France

    Co-Author: JL. Schanen, PhD – Université Grenoble Alpes

    Co-Author: Alexis Derbey – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab

    Co-Author: Betina Zynger-Capaverde – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab

    Co-Author: Jean-Michel Guichon – Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab

  • 11:30 AM – 1:30 PM ET
    Improvement in Short-Circuit Robustness of SiC-MOSFETs based Power Modules using Two-Level Turn-On (2LTO)

    Technical Dialogue Presenter: Hadiuzzaman Syed – Robert Bosch GmbH

    Co-Author: Muhammad Muneeb Alam, Masters of Science in Electrical Power Engineering (he/him/his) – Robert Bosch GmbH

    Co-Author: Saad Khalid (he/him/his) – Robert Bosch GmbH

    Co-Author: Nisar Ahmed Khan – Robert Bosch GmbH

    Co-Author: Sebastian Strache – Robert Bosch GmbH

    Co-Author: Ngoc Ho Tran – Robert Bosch GmbH

  • 11:30 AM – 1:30 PM ET
    GaN-Based Two Stage Point-of-Load (PoL) Converter with 2.5D Embedded Substrate Implementation

    Technical Dialogue Presenter: Samuel Defaz, PhD – Stony Brook University

    Co-Author: Yang Li – Stony Brook University

    Co-Author: Fang Luo, PhD (he/him/his) – Stony Brook University

    Co-Author: Xin Zhang, PhD – IBM

    Co-Author: Raveesh Magod – Texas Instruments

  • 11:30 AM – 1:30 PM ET
    Near-Field Coupling Mitigation of the Noise from High Voltage DC-Link Decoupling Capacitors in Voltage Source Converters

    Technical Dialogue Presenter: Samuel Defaz, PhD – Stony Brook University

    Co-Author: Yuxuan Wu – Stony Brook University

    Co-Author: Kushan Choksi – Stony Brook University

    Co-Author: Fang Luo, PhD (he/him/his) – Stony Brook University

  • 11:30 AM – 1:30 PM ET
    Advantages of Paralleling SiC MOSFETs in High-Performance Power Modules

    Technical Dialogue Presenter: Steffen Beushausen – Robert Bosch GmbH

    Co-Author: Dominik Alexander Ruoff – Robert Bosch GmbH

    Co-Author: Wenqi Zhou – Robert Bosch GmbH

    Co-Author: Karl Oberdieck – Robert Bosch GmbH

  • 11:30 AM – 1:30 PM ET
    A SiC Half-Bridge Power Module based on Liquid Metal Packaging for High Performance and Low Thermal Stress

    Technical Dialogue Presenter: Wei Mu, Ph.D – Cambridge University

    Co-Author: Janabi Ameer – Cambridge University

    Co-Author: Luke Shillaber – Cambridge University

    Co-Author: Borong Hu – Cambridge University

    Co-Author: Teng Long – University of Cambridge

  • 11:30 AM – 1:30 PM ET
    Analysis and Modeling of Radiated EMI Considering Coupling Between Power Converter and Power Cable with LC-Type EMI Filter

    Technical Dialogue Presenter: Qinghui Huang – University of Florida

    Co-Author: Yirui Yang, PhD (he/him/his) – University of Florida

    Co-Author: Shuo Wang – University of Florida

    Co-Author: Zhedong Ma – Apple

    Co-Author: Yingjie Zhang, MS – University of Florida

    Co-Author: Yanwen Lai – University of Florida

  • 11:30 AM – 1:30 PM ET
    Simple Prediction Method for Impacts of Switching Characteristics on EMI Noise of a Three-Phase PWM Inverter

    Technical Dialogue Presenter: Shinobu Nagasawa (he/him/his) – Mitsubishi Electric Corporation

    Co-Author: Toshiya Tadakuma, Dr.Eng. (he/him/his) – Mitsubishi Electric Corporation

    Co-Author: Keita Takahashi – Mitsubishi Electric corporation

  • 11:30 AM – 1:30 PM ET
    Coaxially Nested 3.3 kV SiC MOSFET Packages with Uniform Interpackage Electric Field Distribution

    Technical Dialogue Presenter: Jack Knoll, MS (he/him/his) – Virginia Tech

    Co-Author: Mark Cairnie – Virginia Tech

    Co-Author: Christina DiMarino – CPES, Virginia Tech

  • 11:30 AM – 1:30 PM ET
    Thermal Modeling and Performance of a Bare-Die Embedded PCB for High Power Density Converters Design

    Technical Dialogue Presenter: Shahid Aziz Khan – University of Michigan

    Co-Author: Feng Zhou – Toyota Research Institute of North America

    Co-Author: Mengqi Wang, PhD (she/her/hers) – University of Michigan-Dearborn

    Co-Author: Ducdung Le – University of Michigan-Dearborn

    Co-Author: Shivam Chaturvedi, PhD (he/him/his) – University of Michigan Dearborn