Overview Designing high density power delivery systems is the hot (thermal management) topic in a fast changing (transient response) segment that results in some of the most innovative power solutions in the world. TDK’s high current µPOL regulators are one of the latest to crest existing size and performance barriers. Achieving these breakthrough densities requires a dual focus on thermal and electrical innovation.
TDK’s FS1412 is the first in a family of power modules to offer embedded silicon technology (SESUB) combined with our CapDriveTM control topology … stacking the deck for vertical power delivery.
Thermal Performance SESUB technology is a Silicon Embedded SUBstrate that enables us to implant the power IC deep in a stack of copper that allows the inductor to be on top of the silicon; saving space while providing the ultimate thermal solution. Having the best thermal management possible is very important, but it is only the beginning. We also need a control topology that can deliver the challenging electrical performance required.
CapDrive Topology TDK’s high current µPOL regulators are designed using CapDrive, a capacitor coupled, interleaved buck that lends itself to parallel operation. By splitting the current between two power paths in the module we can reduce the inductor component height, and thus the overall height of the module. The coupled capacitor topology has several key advantages for electrical performance: • Reduces power loss for increased efficiency • Improves transient response • Reduces switch voltage stress • Allows for smaller geometry silicon • Reduces noise • Improves current sharing • Doubles the duty cycle Conclusion µPOL regulators deliver the ultimate 1-2 punch, combining innovative packaging technology with a powerful control topology … µPOL regulators are stacking the deck for vertical power delivery.
