Mersen develops customer specific SiC power stack designs as well as evaluation kits, from a few 10’s to several 100’s of kVA. This workflow usually starts with the thermal simulation of the cooling solution based upon the expected power module losses. The next step generally aims at lowering the DC-link inductance loop by optimizing the design of the bus bar-capacitor link to keep the inductance value as low as 10nH. This paper will review the simulation strategies we use at Mersen, exemplified by real-case studies. Finally, this paper will highlight our latest developments regarding power stack control and how we support our customer across the development journey, from the converter topology, the selection of semiconductor technology to the PWM digital signal generation.