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Dialogue Preview Sessions

Power Electronics Packaging

D11.15 - Thermal Modeling and Performance of a Bare-Die Embedded PCB for High Power Density Converters Design

Monday, March 17, 2025
12:00 PM – 1:30 PM ET
Location: Level Four, Sidney J. Marcus Auditorium Foyer
The key goals in developing power electronics converters for the demanding electrified transportation industry are achieving high power density and efficiency with optimal thermal performance. This research focuses on the thermal aspect of a new bare-die embedding technique that incorporates the bare-die of the switching devices (such as MOSFETs) into the layers of the printed circuit board (PCB). This technique ensures high power density and minimal parasitics, improving efficiency. However, the thermal design of such an approach is challenging and needs special design considerations. A thermal design framework and the thermal model are proposed and validated, and the superior thermal performance of the bare-die embedded technique compared to the existing packaging techniques is proved through hardware and experimental results.