Taiyo America
Jason leads Taiyo’s Corporate Venture Capital developments and advanced packaging efforts with Western OEMs. His industry experience extends from both developing new electronic materials to their deployment in power electronics to sensors to advanced digital packaging. The nature of electronics has resulted in a career spanning leading global corporations such as Corning Inc., Sekisui Chemical of Japan, and Wacker Chemie of Germany. Industry contributions include being a track chair for IMAPS Device Packaging Conference, member of the AMT committee for ECTC, PSMA Packaging committee and supporting 3D-PEIM, plus a startup reviewer for NREL’s Industry Growth Conference. He obtained a PhD in Chemistry from Lehigh University, an MBA from Fordham University and has a BA in Chemistry from Alfred University.
IS04 - 3D-Power Packaging for AI and Vehicles
Tuesday, March 18, 2025
8:30 AM – 11:55 AM ET