Chongqing University
Jinpeng Cheng (Student Member, IEEE) was born in AnHui, China, in 1999. He received the B.S. degree in Electrical Engineering from Shenyang University of Technology, Shenyang, China, in 2021. He is currently pursuing the Ph.D. degree in Electrical Engineering at Chongqing University, Chongqing, China.
His research interests include thermal management and packaging design of power modules, as well as integration techniques.
T37.2 - Discrete Power Device Packaging with Integrated Direct Two-Phase Cooling
Thursday, March 20, 2025
10:30 AM – 10:50 AM ET