Peter Vines

nexperia

Presentation(s):

• T24.6 - Board Level Reliability of Gull-Wing, Micro-Leaded and Lead-Less Packaged MOSFETs in Automotive Environments

  Wednesday, March 19, 2025
  3:40 PM – 4:00 PM ET

• T27.4 - Optimizing MOSFET Selection for EMC-Critical Automotive Applications

  Thursday, March 20, 2025
  9:00 AM – 9:20 AM ET

• T35.4 - Experimental Validation of Triangular SOA via Infrared Thermography of a MOSFET Die Operating in the Thermally Unstable Linear-Mode for Automotive Applications

  Thursday, March 20, 2025
  11:10 AM – 11:30 AM ET