nexperia
T24.6 - Board Level Reliability of Gull-Wing, Micro-Leaded and Lead-Less Packaged MOSFETs in Automotive Environments
Wednesday, March 19, 20253:40 PM – 4:00 PM ET
T35.4 - Experimental Validation of Triangular SOA via Infrared Thermography of a MOSFET Die Operating in the Thermally Unstable Linear-Mode for Automotive Applications
Thursday, March 20, 202511:10 AM – 11:30 AM ET
