ASE, USA
Vikas Gupta has more than 20 years’ experience in semiconductor packaging through various academic and industry roles at Lucent Technologies, Lehigh University, Texas Instruments and ASE Group. Currently, he is a director in engineering, technical promotion, and marketing team at ASE.
Vikas holds 25+ US patents and forty+ industry publications. Vikas is co-chair of the Applied Reliability committee for IEEE ECTC and chairs the Automotive technical working group of Heterogeneous Integration Roadmap.
IS04.3 - PowerSiP packaging for AI/datacenter applications
Tuesday, March 18, 2025
9:20 AM – 9:45 AM ET