T37 - Packaging of Power Devices & Modules

Technical Lecture Session Chair(s)

• LG

  Lee Gill

  Sandia National Laboratories
• 

  Joshua Stewart, PhD

  The Aerospace Corporation

Student Session Assistant(s)

• BN

  Bruno Nanino

  University of Udine

Presentations:

• 10:10 AM – 10:30 AM ET

  Organic Direct Bonded Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging
  

  Technical Lecture Presenter: Shuofeng Zhao, PhD (he/him/his) – National Renewable Energy Laboratory

  Co-Author: Joshua Major – NREL

  Co-Author: Douglas DeVoto – NREL

  Co-Author: Sarwar Islam – National Renewable Energy Laboratory

  Co-Author: Xiaoling Li – National Renewable Energy Laboratory

  Co-Author: Mike Tant – National Renewable Energy Laboratory

  Co-Author: Faisal Khan – National Renewable Energy Laboratory

  Co-Author: Sreekant Narumanchi – National Renewable Energy Laboratory
• 10:30 AM – 10:50 AM ET

  Discrete Power Device Packaging with Integrated Direct Two-Phase Cooling
  

  Technical Lecture Presenter: Jinpeng Cheng, PhD (he/him/his) – Chongqing University

  Co-Author: Jinxiao Wei – Chongqing-Warwick Joint Laboratory in Silicon Carbide Power Electronics

  Co-Author: Hao Feng – Chongqing University

  Co-Author: Li Ran – Chongqing-Warwick Joint Laboratory in Silicon Carbide Power Electronics
• 10:50 AM – 11:10 AM ET

  Investigation of Die Top-Side Re-Metallization for SiC-Based Double-Side Cooled Power Modules
  

  Technical Lecture Presenter: Narayanan Rajagopal – Center for Power Electronics Systems (CPES) - Virginia Tech

  Co-Author: Christina DiMarino – CPES, Virginia Tech
• 11:10 AM – 11:30 AM ET

  Design of Low Parasitic Inductance GaN HEMT Flip-Chip Power Module
  

  Technical Lecture Presenter: Mohammad Dehan Rahman (he/him/his) – University of Arkansas

  Co-Author: Tanzila Akter – University of Arkansas

  Co-Author: Abu Shahir Md Khalid Hasan, MS – University of Arkansas

  Co-Author: Alan Mantooth, PhD – University of Arkansas

  Co-Author: Xiaoqing Song – University of Arkansas
• 11:30 AM – 11:50 AM ET

  A Scalable Dual-Orthogonal-Cooling Packaging Concept for Parallel-Series SiC Chips
  

  Technical Lecture Presenter: Ekaterina Muravleva – University of Nebraska-Lincoln

  Co-Author: Youssef Abotaleb – University of Nebraska-Lincoln

  Co-Author: Blake Anderson – University of Nebraska-Lincoln

  Co-Author: Jerry Hudgins – University of Nebraska-Lincoln

  Co-Author: Jun Wang, PhD – University of Nebraska–Lincoln

  Co-Author: Zichen Zhang – Virginia Tech

  Co-Author: Boyi Zhang – Delta Electronics (Americas) Ltd.