Full Schedule

7:00 AM – 8:00 AM ET

Technical Lecture and Industry Session Speaker Breakfast

Location: Omni Hotel, Level M2, International EF

7:00 AM – 4:00 PM ET

Speaker Ready Room Open

Location: Level Four, A406/A407

8:00 AM – 9:00 AM ET

ITRG

Location: Omni Hotel, Level M4, Grand C

IEEE PELS Meetings

8:00 AM – 9:30 AM ET

Spouse Breakfast

Location: Omni Hotel, Level M2, International A

8:00 AM – 9:30 AM ET

TC 7: Critical Power and Energy Storage Systems

Location: Omni Hotel, Level M4, Grand B

IEEE PELS Meetings

8:00 AM – 3:00 PM ET

Registration Open

Location: Level Four, Registration Hall A

8:00 AM – 3:00 PM ET

Spouse And Guest Hospitality Room Open

Location: Omni Hotel, Level M2, International A

8:30 AM – 11:55 AM ET

IS01 - Powering the Post 48V Era: Addressing the Datacenter-Level Power Delivery Challenges in the AI Revolution

Location: Level Four, A412

Industry Session Chair: – Google

Industry Session Chair: – Virginia Polytechnic Institute and State University

Student Session Assistant: – KU Leuven

8:30 AM – 8:55 AM ET

IS01.1 - ML Challenges to the 48V Architecture and the Next Generation Rack with +/-400Vdc bus

Location: Level Four, A412

Industry Session Presenter: – Google

8:55 AM – 9:20 AM ET

IS01.2 - Solid State Transformer (SST-Based) DC Architecture for Datacenter Applications

Location: Level Four, A412

Industry Session Presenter: – Delta Electronics (Americas) Ltd

9:20 AM – 9:45 AM ET

IS01.3 - Novel Quasi-Single-Stage Isolated 3-φ PFC Rectifier Concept Breaking Through the 99% Efficiency Barrier

Location: Level Four, A412

Industry Session Presenter: – ETH Zurich

9:45 AM – 10:10 AM ET

IS01.4 - MV SiC Power Electronics for Data Centers: Advantages, Challenges, and Control

Location: Level Four, A412

Industry Session Presenter: – Virginia Polytechnic Institute and State University

Co-Author: – Virginia Polytechnic Institute and State University

10:40 AM – 11:05 AM ET

IS01.5 - Potential Benefits of DC Power Distribution Bus in Data Center Applications

Location: Level Four, A412

Industry Session Presenter: – Siemens

Co-Author: – Siemens

Co-Author: – Siemens Mobility Inc.

11:05 AM – 11:30 AM ET

IS01.6 - New Strategies in Design to Meet the Demands of AI Data Centers

Location: Level Four, A412

Industry Session Presenter: – ABB

11:30 AM – 11:55 AM ET

IS01.7 - Integrated GaN Solution for Server Power Supply Units

Location: Level Four, A412

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments, Inc.

8:30 AM – 11:55 AM ET

IS02 - Global Electrification Continues to Grow, the Need for New Passives and Design Methods for Power Applications Has to Match

Location: Level Four, A411

Industry Session Chair: – YAGEO

Industry Session Chair: – Würth Elektronik

Student Session Assistant: – Universidad de Talca

PSMA Session

8:30 AM – 8:55 AM ET

IS02.1 - Capacitors and Aircraft Power System Considerations for Higher Temperature Operation and Wide Bandgap Enablement

Location: Level Four, A411

Industry Session Presenter: – Lockheed Martin

PSMA Session

8:55 AM – 9:20 AM ET

IS02.2 - Considerations for Choosing Capacitors for High Power Applications

Location: Level Four, A411

Industry Session Presenter: – Würth Elektronik

PSMA Session

9:20 AM – 9:45 AM ET

IS02.3 - Vapor Deposited Thin Film Thermoset Polymer Dielectrics for High-Performance, High-Reliability, Capacitors for In-Module Snubber Applications.

Location: Level Four, A411

Industry Session Presenter: – Polycharge

PSMA Session

9:45 AM – 10:10 AM ET

IS02.4 - Utilizing Machine Learning Techniques for Reliability Analysis and Health Monitoring of DC-Link Capacitors

Location: Level Four, A411

Industry Session Presenter: – Miami University

PSMA Session

10:40 AM – 11:05 AM ET

IS02.5 - Improving the EMI Performance of Isolated Power Modules

Location: Level Four, A411

Industry Session Presenter: – Würth Elektronik

PSMA Session

11:05 AM – 11:30 AM ET

IS02.6 - The Significance of Managing Reactive Power in the Volatile, Uncertain, Complex, and Ambiguous (VUCA) Electric Energy Market

Location: Level Four, A411

Industry Session Presenter: – Ducati

PSMA Session

11:30 AM – 11:55 AM ET

IS02.7 - Increasing the Confidence of Capacitor Life Calculations and the Tools Used

Location: Level Four, A411

Industry Session Presenter: – YAGEO

PSMA Session

8:30 AM – 11:55 AM ET

IS03 - Innovations in Motor Drives

Location: Level Four, A410

Industry Session Chair: – Texas Instruments

Industry Session Chair: – Infineon Technologies

Student Session Assistant: – Zhejiang University

8:30 AM – 8:55 AM ET

IS03.1 - Comparative Study of Surface Mount SiC MOSFETs in13kW Motor Drive for HVAC E-Compressor in EVs

Location: Level Four, A410

Industry Session Presenter: – Wolfspeed

Co-Author: – Wolfspeed

8:55 AM – 9:20 AM ET

IS03.2 - Design and Optimization of SiC-Based 11kW Motor Drive with High Efficiency

Location: Level Four, A410

Industry Session Presenter: – wolfspeed

Co-Author: – wolfspeed

Co-Author: – Wolfspeed

9:20 AM – 9:45 AM ET

IS03.3 - Enhance Traction Motor Efficiency using a GaN based Four-Level Flying Capacitors Inverter

Location: Level Four, A410

Industry Session Presenter: – Efficient Power Conversion

Co-Author: – Politecnico di Torino

9:45 AM – 10:10 AM ET

IS03.4 - Highly integrated coin-sized 1 kW GaN-based motor drive

Location: Level Four, A410

Industry Session Presenter: – Infineon Technologies Austria AG

Co-Author: – Infineon Technologies Austria AG

10:40 AM – 11:05 AM ET

IS03.5 - Meeting Standby Power Regulations in Motor Drive Applications

Location: Level Four, A410

Industry Session Presenter: – Power Integrations

Co-Author: – Power Integrations

11:05 AM – 11:30 AM ET

IS03.6 - Reduction of Motor Bearing Currents in Variable Frequency Drives Using CoolBLUE® and NaLA® Cores

Location: Level Four, A410

Industry Session Presenter: – MAGNETEC GmbH

Co-Author: – Magnetec Inc.

Co-Author: – MAGNETEC GmbH

11:30 AM – 11:55 AM ET

IS03.7 - Three-Phase Integrated GaN IPM Technology for Enhancing Power Efficiency and Density for Motor-Drive System

Location: Level Four, A410

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

8:30 AM – 11:55 AM ET

IS04 - 3D-Power Packaging for AI and Vehicles

Location: Level Four, A402

Industry Session Chair: – Taiyo America

Industry Session Chair: – Narveson Consulting

PSMA Session

8:30 AM – 8:55 AM ET

IS04.1 - Off-Road Vehicles' Power Electronics - Packaging and Thermal Management

Location: Level Four, A402

Industry Session Presenter: – John Deere

PSMA Session

8:55 AM – 9:20 AM ET

IS04.2 - Modern power conversion enabled by WGB semiconductors and innovative package solutions

Location: Level Four, A402

Industry Session Presenter: – Infineon Technologies AG

PSMA Session

9:20 AM – 9:45 AM ET

IS04.3 - PowerSiP packaging for AI/datacenter applications

Location: Level Four, A402

Industry Session Presenter: – ASE, USA

PSMA Session

9:45 AM – 10:10 AM ET

IS04.4 - Power Technology Report on Embedded and Integrated Magnetics

Location: Level Four, A402

Industry Session Presenter: – Tyndall National Institute

PSMA Session

10:40 AM – 11:05 AM ET

IS04.5 - Advanced Package of Power Modules for AI

Location: Level Four, A402

Industry Session Presenter: – Cyntec Co. Ltd., Taiwan

PSMA Session

11:05 AM – 11:30 AM ET

IS04.6 - A packaging solution for powering AI processors

Location: Level Four, A402

Industry Session Presenter: – Ferric Inc., USA

PSMA Session

11:30 AM – 11:55 AM ET

IS04.7 - Integrated GaN & Passive Modules by Panel Level Manufacturing for AI data centers

Location: Level Four, A402

Industry Session Presenter: – AOI Electronics, Japan

PSMA Session

8:30 AM – 11:55 AM ET

IS05 - WBG Applications & Control

Location: Level Four, A403

Industry Session Chair: – Infineon Technologies

Student Session Assistant: – Tennessee Tech University

8:30 AM – 8:55 AM ET

IS05.1 - A Cost Effective Hybrid FOC Solution for Power Tool Applications

Location: Level Four, A403

Industry Session Presenter: – Infineon Technologies Americas Corp.

Co-Author: – Infineon Technologies

8:55 AM – 9:20 AM ET

IS05.2 - An Enhanced Pulse Width Modulation Control Technique Optimized for High Conversion Efficiency Across Input Line and Load

Location: Level Four, A403

Industry Session Presenter: – Power Integrations

Co-Author: – Power Integrations

9:20 AM – 9:45 AM ET

IS05.3 - How to easily convert a hard-switched full-bridge to a zero-voltage-switched full-bridge

Location: Level Four, A403

Industry Session Presenter: – Texas Instruments

Co-Author: – Texas Instruments

9:45 AM – 10:10 AM ET

IS05.4 - Oscillation stability of parallel connected SiC MOSFETs

Location: Level Four, A403

Industry Session Presenter: – Toshiba America Electronic Components, Inc.

10:40 AM – 11:05 AM ET

IS05.5 - Paralleling of 3x GaN FETs to 30 kW and Beyond

Location: Level Four, A403

Industry Session Presenter: – Renesas Electronics

Co-Author: – Renesas Electronics

11:05 AM – 11:30 AM ET

IS05.6 - SR FET Spike Reduction and Primary Switch ZVS During CCM Operation of a Flyback Converter

Location: Level Four, A403

Industry Session Presenter: – Power Integrations Inc

11:30 AM – 11:55 AM ET

IS05.7 - The Safest, Simplest and Most Efficient SiC : Analog Devices’ SiC Smart Switch

Location: Level Four, A403

Industry Session Presenter: – Automotive Electrification at Analog Devices, Inc.

Co-Author: – Automotive Electrification at Analog Devices, Inc.

8:30 AM – 11:55 AM ET

IS06 - Reliability Redefined: Optimizing the Design-to-Production Transition for Superior Product Performance

Location: Level Four, A404/A405

Industry Session Chair: – L3Harris

Industry Session Chair: – IBM

Student Session Assistant: – CEA

PSMA Session

8:30 AM – 8:55 AM ET

IS06.1 - Improving Power System Performance and Power Integrity using Time Domain Reflectometry (TDR)

Location: Level Four, A404/A405

Industry Session Presenter: – Tektronix

Co-Author: – Tektronix, Inc.

PSMA Session

8:55 AM – 9:20 AM ET

IS06.2 - Smart Motors: Harnessing Sensor Data and AI for Predictive Maintenance

Location: Level Four, A404/A405

Industry Session Presenter: – Tektronix

Co-Author: – Tektronix India Pvt. Ltd.

Co-Author: – N/A

PSMA Session

9:20 AM – 9:45 AM ET

IS06.3 - Ideas for Practical Use Case of Advanced Power Management Telemetry for System Reliability and Predictive Maintenance

Location: Level Four, A404/A405

Industry Session Presenter: – TDK

Co-Author: – TDK

PSMA Session

9:45 AM – 10:10 AM ET

IS06.4 - Joint GaN Technology Study

Location: Level Four, A404/A405

Industry Session Presenter: – IBM

PSMA Session

10:40 AM – 11:05 AM ET

IS06.5 - Verification of Additional Core Loss Due to Temperature, Voltage and Time at High Frequencies with Accelerated Voltage and Thermal Test

Location: Level Four, A404/A405

Industry Session Presenter: – Wurth Elektronik

PSMA Session

11:05 AM – 11:30 AM ET

IS06.6 - IPC 9592C Discussion

Location: Level Four, A404/A405

Industry Session Presenter: – IBM

PSMA Session

8:30 AM – 12:00 PM ET

T01 - AC-DC Converters I

Location: Level Three, A315

Technical Lecture Session Chair: – Arizona State University

Technical Lecture Session Chair: – Apple

Student Session Assistant: – The Ohio State University

8:30 AM – 8:50 AM ET

T01.1 - Versatile Controller Architecture for a Universal DC Fast Charging Front-End

Location: Level Three, A315

Technical Lecture Presenter: – University of Colorado Boulder

Co-Author: – University of Colorado Boulder

Co-Author: – FreeWire Technologies

Co-Author: – University of Colorado Boulder

Single-Phase and Three-Phase Input

8:50 AM – 9:10 AM ET

T01.2 - A 10 kV SiC MOSFET based Three-Phase Single-Stage Isolated MVAC/LVDC Converter for Solid State Transformer Applications

Location: Level Three, A315

Technical Lecture Presenter: – Delta Electronics Americas

Co-Author: – Delta Electronics (Americas) Ltd.

Co-Author: – Delta Electronics (Americas) Ltd

Co-Author: – Delta Electronics

Power Factor Correction: CCM, DCM, CRM/BCM Control, Bridgeless

9:10 AM – 9:30 AM ET

T01.3 - Direct Digital Control Applied to T-Type Vienna Rectifiers for Power Factor Correction

Location: Level Three, A315

Technical Lecture Presenter: – National Tsing-hau University

Co-Author: – National Tsing Hua University

Co-Author: – National Tsing-hua University

Power Factor Correction: CCM, DCM, CRM/BCM Control, Bridgeless

9:30 AM – 9:50 AM ET

T01.4 - Active Power Decoupling Method based on Dual Active Bridge Converter without Additional Components

Location: Level Three, A315

Technical Lecture Presenter: – Nagaoka University of Technology

Co-Author: – Nagaoka University of Technology

Bidirectional AC-DC Converters

9:50 AM – 10:10 AM ET

T01.5 - An ANPC-Based Building Block for Medium-Voltage Applications

Location: Level Three, A315

Technical Lecture Presenter: – University of Arkansas

Co-Author: – Wolfspeed

Co-Author: – University of Arkansas

Co-Author: – university of Arkansas

Co-Author: – University of Arkansas

Bidirectional AC-DC Converters

10:40 AM – 11:00 AM ET

T01.6 - Analog Control of a 2.5 kW GaN based CRM PFC with Input Filter Optimization

Location: Level Three, A315

Technical Lecture Presenter: – Arizona State University

Co-Author: – Arizona State University

Single-Phase and Three-Phase Input

11:00 AM – 11:20 AM ET

T01.7 - An iTHD and Efficiency Optimized Control Method for Triangular Conduction Mode Totem Pole Bridgeless PFC with Zero Current Detection

Location: Level Three, A315

Technical Lecture Presenter: – Texas Instruments, Inc.

Co-Author: – Texas Instruments

Power Factor Correction: CCM, DCM, CRM/BCM Control, Bridgeless

11:20 AM – 11:40 AM ET

T01.8 - Resonance Current Suppression for AC-DC Active-Clamp Flyback Converter by Triangular Current Mode

Location: Level Three, A315

Technical Lecture Presenter: – Nagaoka University of Technology

Co-Author: – Nagaoka University of Technology

External AC-DC Adapters

11:40 AM – 12:00 PM ET

T01.9 - A Universal DC Fast Charging Front-End with Optimized Film Capacitor Design

Location: Level Three, A315

Technical Lecture Presenter: – University of Colorado Boulder

Co-Author: – University of Colorado Boulder

Co-Author: – FreeWire Technologies

Co-Author: – University of Colorado Boulder

Single-Phase and Three-Phase Input

8:30 AM – 12:00 PM ET

T02 - Bi-directional DC-DC Converters

Location: Level Three, A302

Technical Lecture Session Chair: – University of Toronto

Technical Lecture Session Chair: – Texas Instruments

Student Session Assistant: – University of Toronto

8:30 AM – 8:50 AM ET

T02.1 - Power Characterization of a 1200-V/800-V 22-kVA 30-kHz Unity-Gain Dual-Active-Bridge Converter Prototype

Location: Level Three, A302

Technical Lecture Presenter: – Nanyang Technological University

Co-Author: – Amperesand

Co-Author: – NTU

Bidirectional DC-DC Converters

8:50 AM – 9:10 AM ET

T02.2 - Design of Fully Soft-Switched Semi-Dual Active DC-DC Converter for Battery Charging Application

Location: Level Three, A302

Technical Lecture Presenter: – Indian Institute of Technology Bombay

Co-Author: – Indian Institute of Technology Bombay

Co-Author: – Indian Institute of Technology Bombay, India

Hard- and Soft-Switched

9:10 AM – 9:30 AM ET

T02.3 - A ZCS-ZVS Strategy for Low Impedance Dual Active Bridges in MHz Range

Location: Level Three, A302

Technical Lecture Presenter: – The University of Texas at Austin

Co-Author: – UT Austin

Bidirectional DC-DC Converters

9:30 AM – 9:50 AM ET

T02.4 - T-Type Multilevel DAB Converter with Reduced Backflow Power

Location: Level Three, A302

Technical Lecture Presenter: – Khalifa University

Co-Author: – IIT Patna

Co-Author: – Khalifa University

Bidirectional DC-DC Converters

9:50 AM – 10:10 AM ET

T02.5 - A 6.6 kW Highly Efficient Reconfigurable Dual Active Bridge Converter Designed using Planar Transformer, SiC-Fets and Monolithic Bidirectional Devices

Location: Level Three, A302

Technical Lecture Presenter: – Kiel University

Co-Author: – Kiel University

Co-Author: – Christian-Albrechts-Universität zu Kiel

Bidirectional DC-DC Converters

10:40 AM – 11:00 AM ET

T02.6 - Interleaved Switched-Inductor-Based SIPO Partial Power Converter Module for Battery Management Systems

Location: Level Three, A302

Technical Lecture Presenter: – city university of hongkong

Co-Author: – City University of Hong Kong

Bidirectional DC-DC Converters

11:00 AM – 11:20 AM ET

T02.7 - Single Sensor-Based Fault Localization and Detection in GaN Three-Phase Dual Active Bridge Converters

Location: Level Three, A302

Technical Lecture Presenter: – University of Toronto

Co-Author: – University of Toronto

Bidirectional DC-DC Converters

11:20 AM – 11:40 AM ET

T02.8 - Enhanced Cocharge Operation Scheme in Bidirectional PhaseShift Full-Bridge Converters with Eliminated Voltage Overshoot and Reduced Freewheeling Current

Location: Level Three, A302

Technical Lecture Presenter: – Virginia Tech

Co-Author: – Virginia Polytechnic Institute and State University

Bidirectional DC-DC Converters

11:40 AM – 12:00 PM ET

T02.9 - DC Bias Elimination in Isolated DC-DC Converters using Fundamental-Frequency Ripple

Location: Level Three, A302

Technical Lecture Presenter: – Kiel University

Co-Author: – Kiel University

Co-Author: – Christian-Albrechts-Universität zu Kiel

Bidirectional DC-DC Converters

8:30 AM – 12:00 PM ET

T03 - Single & Multiphase Inverters

Location: Level Three, A311

Technical Lecture Session Chair: – Purdue University

Technical Lecture Session Chair: – Delta Electronics (Americas) Ltd.

Student Session Assistant: – Universidade Federal de Minas Gerais

8:30 AM – 8:50 AM ET

T03.1 - Tunable Matching Network with Dual Phase-Switched Impedance Modulation Actuators

Location: Level Three, A311

Technical Lecture Presenter: – MKS Instruments Inc.

Co-Author: – Massachusetts Institute of Technology

Single and Multi-Phase Inverters

8:50 AM – 9:10 AM ET

T03.2 - Soft-Switched Pulsed Bias Plasma Supply System

Location: Level Three, A311

Technical Lecture Presenter: – Massachusetts Institute of Technology

Co-Author: – MKS Instruments Inc.

Co-Author: – Massachusetts Institute of Technology

Single and Multi-Phase Inverters

9:10 AM – 9:30 AM ET

T03.3 - Analysis and Design of a Cyclo-Active-Bridge Inverter for Single-Stage Three-Phase Grid Interface

Location: Level Three, A311

Technical Lecture Presenter: – Princeton University

Co-Author: – Princeton University

Co-Author: – ABB Corporate Research

Co-Author: – Princeton University

Single and Multi-Phase Inverters

9:30 AM – 9:50 AM ET

T03.4 - Modular Nanosecond Pulse Generator Leveraging GaN and SiC for Versatility and Performance

Location: Level Three, A311

Technical Lecture Presenter: – Universidad de Zaragoza / I3A

Co-Author: – Universidad de Zaragoza

Co-Author: – University of Zaragoza

Multilevel Inverters

9:50 AM – 10:10 AM ET

T03.5 - A Variable Frequency Technique for EMI and Efficiency Improvements in High-Level Count Flying Capacitor Multilevel Converters

Location: Level Three, A311

Technical Lecture Presenter: – University of California, Berkeley

Co-Author: – University of California Berkeley

Co-Author: – UC Berkeley

Co-Author: – University of California-Berkeley

Power Quality and EMI

10:40 AM – 11:00 AM ET

T03.6 - Analysis and Implementation of Minimum-Sensor Capacitor Voltage Estimators for Flying Capacitor Multilevel Converters

Location: Level Three, A311

Technical Lecture Presenter: – University of California, Berkeley

Co-Author: – University of California Berkeley

Co-Author: – UC Berkeley

Co-Author: – University of California-Berkeley

Multilevel Inverters

11:00 AM – 11:20 AM ET

T03.7 - Single-Stage Bidirectional High-Frequency Link DC to Three-Phase AC (4-Wire) Grid-Tied Microinverter

Location: Level Three, A311

Technical Lecture Presenter: – Georgia Institute of Technology

Co-Author: – Georgia Institute of Technology

Co-Author: – Indian Institute of Technology Roorkee

Co-Author: – Georgia Institute of Technology

Single and Multi-Phase Inverters

11:20 AM – 11:40 AM ET

T03.8 - Analysis and Design of a Constant Current LCC Class-E Inverter

Location: Level Three, A311

Technical Lecture Presenter: – Peking University

Co-Author: – Peking University

Single and Multi-Phase Inverters

11:40 AM – 12:00 PM ET

T03.9 - Series Connected Class-E Push-Pull Converters using GaN HEMT for High-Efficiency RF Generators in Float Zone Silicon Production

Location: Level Three, A311

Technical Lecture Presenter: – AALBORG UNIVERSITY

Co-Author: – Aalborg University

Single and Multi-Phase Inverters

8:30 AM – 12:00 PM ET

T04 - GaN Power Devices

Location: Level Three, A312

Technical Lecture Session Chair: – Johns Hopkins University Applied Physics Laboratory

Technical Lecture Session Chair: – Purdue

Student Session Assistant: – Rensselaer Polytechnic Institute

8:30 AM – 8:50 AM ET

T04.1 - State of the Art 1.7kV Lateral GaN HEMTs, an Alternative to SiC

Location: Level Three, A312

Technical Lecture Presenter: – Power Integrations

Co-Author: – Power Integrations

GaN and SiC Devices and Modules

8:50 AM – 9:10 AM ET

T04.2 - Modeling and Characterization of Current and Future 1.2 kV Wide Bandgap Semiconductor-Based MOSFETs

Location: Level Three, A312

Technical Lecture Presenter: – University of Toledo

Co-Author: – The University of Toledo

Co-Author: – University of Toledo

Co-Author: – The University of Toledo

Co-Author: – University of Toledo

Co-Author: – The University of Toledo

Co-Author: – University of Toledo

Co-Author: – U.S. Naval Research Laboratory

Co-Author: – University of Toledo

GaN and SiC Devices and Modules

9:10 AM – 9:30 AM ET

T04.3 - 2.5-kV 6.4-ns 100-kHz Repetitive GaN Marx Generator

Location: Level Three, A312

Technical Lecture Presenter: – UESTC

Co-Author: – UESTC

GaN and SiC Devices and Modules

9:30 AM – 9:50 AM ET

T04.4 - Novel Dual Output LDO Architecture in 650-V GaN Technology for Power ICs

Location: Level Three, A312

Technical Lecture Presenter: – Wise integration

Co-Author: – MindCET

Co-Author: – Wise integration

Co-Author: – MinDCet NV

Co-Author:

GaN and SiC Devices and Modules

9:50 AM – 10:10 AM ET

T04.5 - Impact of Substrate Bias on the Stability of Bidirectional GaN HEMT in Hard- and Soft-Switching

Location: Level Three, A312

Technical Lecture Presenter: – Virginia Tech

Co-Author: – Virginia Polytechnic Institute and State University

Co-Author: – Virginia Tech Center for Power Electronics Systems

GaN and SiC Devices and Modules

10:40 AM – 11:00 AM ET

T04.6 - Characterization of LED Driven GaN-Based Photoconductive Switches

Location: Level Three, A312

Technical Lecture Presenter: – University of Toledo

Co-Author: – University of Toledo

Co-Author: – Naval Research Labs

Co-Author: – U.S. Naval Research Laboratory

Co-Author: – Naval Research Labs

Co-Author: – U.S. Naval Research Laboratory

Co-Author: – Naval Surface Warfare Center Philadelphia Division

Co-Author: – University of Toledo

GaN and SiC Devices and Modules

11:00 AM – 11:20 AM ET

T04.7 - Development and Validation of Repetitive Transient Gate Overvoltage Rating for GaN HEMTs

Location: Level Three, A312

Technical Lecture Presenter: – EPC Co

Co-Author: – Efficient Power Conversion

Co-Author: – EPC

GaN and SiC Devices and Modules

11:20 AM – 11:40 AM ET

T04.8 - Junction Temperature Monitoring of GaN HEMT by using On-Resistance with Voltage Clamp and Current Shunt

Location: Level Three, A312

Technical Lecture Presenter: – ChongQing university

Co-Author: – ChongQing university

Co-Author: – Chongqing University

Co-Author: – ChongQing university

GaN and SiC Devices and Modules

11:40 AM – 12:00 PM ET

T04.9 - False Turn-On Failure and Protection of p-Gate GaN HEMT in MHz Class-E Resonant Inverter

Location: Level Three, A312

Technical Lecture Presenter: – Peking University

Co-Author: – Peking University

GaN and SiC Devices and Modules

8:30 AM – 12:00 PM ET

T05 - Magnetics Applications I

Location: Level Three, A301

Technical Lecture Session Chair: – Wurth Elektronik

Student Session Assistant: – Universidad de Oviedo

8:30 AM – 8:50 AM ET

T05.1 - Heat Extraction from Ferrite Cores using Metallic Laminations

Location: Level Three, A301

Technical Lecture Presenter: – University of Texas at Austin

Co-Author: – The University of Texas at Austin

Co-Author: – UT Austin

Advanced Magnetic Materials and Geometries

8:50 AM – 9:10 AM ET

T05.2 - Folded Flex-PCB Winding Planar Transformer for High-Frequency Isolated DC-DC Converters

Location: Level Three, A301

Technical Lecture Presenter: – KU Leuven - EnergyVille

Co-Author: – KU Leuven - EnergyVille

Co-Author: – Katholieke Universiteit Leuven - Energyville

Winding Techniques

9:10 AM – 9:30 AM ET

T05.3 - Winding Strategy Analysis and Optimization for High-Current Matrix Transformer

Location: Level Three, A301

Technical Lecture Presenter: – Danmarks Tekniske Universitet

Co-Author: – Technical University of Denmark

Co-Author: – Danmarks Tekniske Universitet

Co-Author: – Technical University of Denmark

Winding Techniques

9:30 AM – 9:50 AM ET

T05.4 - Investigation on Impact of Transformer Parasitic Capacitance on Standby Power Consumption in Power Converters

Location: Level Three, A301

Technical Lecture Presenter: – STMicroelectronics

Co-Author: – STMicroelectronics

Co-Author: – Technical University of Denmark

Winding Techniques

9:50 AM – 10:10 AM ET

T05.5 - PCB-Winding Integrated Transformer for 800-V Dual Active Bridge Converter using 1.2-kV GaN Devices

Location: Level Three, A301

Technical Lecture Presenter: – KU Leuven - EnergyVille

Co-Author: – KU Leuven - EnergyVille

Co-Author: – Katholieke Universiteit Leuven - Energyville

Co-Author: – KU Leuven

High-Frequency Magnetics

10:40 AM – 11:00 AM ET

T05.6 - Comparative Assessment of Inductance Modeling for PCB-Based Circular Spiral Coils in Inductive Power Transfer Systems

Location: Level Three, A301

Technical Lecture Presenter: – École Polytechnique Fédérale de Lausanne (EPFL)

Co-Author: – Power Electronics Laboratory, EPFL

Winding Techniques

11:00 AM – 11:20 AM ET

T05.7 - Compact Air-Core Inductors for Variable Frequency Soft-Switching in 3 Phase Inverters

Location: Level Three, A301

Technical Lecture Presenter: – Columbia University

Co-Author: – Columbia University

High-Frequency Magnetics

11:20 AM – 11:40 AM ET

T05.8 - Simulation and Experimental Research on Cooling Performance of Fully-Immersed Evaporative Cooling High-Frequency Transformer

Location: Level Three, A301

Technical Lecture Presenter: – Xi'an Jiaotong University

Co-Author: – Xi'an Jiaotong University

Co-Author: – Tesla

High-Frequency Magnetics

11:40 AM – 12:00 PM ET

T05.9 - High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications

Location: Level Three, A301

Technical Lecture Presenter: – Tyndall National Institute

Co-Author: – Tyndall National Institute

Co-Author: – TAIYO YUDEN Co. Ltd.

Co-Author: – Taiyo Yuden Co., Ltd.

Co-Author: – Tyndall National Institute

High-Frequency Magnetics

8:30 AM – 12:00 PM ET

T06 - Control of Power Electronic Converters I

Location: Level Three, A313

Technical Lecture Session Chair: – Mississippi State University

Technical Lecture Session Chair: – Delta Electronics (Americas) Ltd.

Student Session Assistant: – Nagoya Institute Of Technology

8:30 AM – 8:50 AM ET

T06.1 - An Adaptive Zero Current Switching Control Technique for Multi-Resonant Switched-Capacitor Converters

Location: Level Three, A313

Technical Lecture Presenter: – UC Berkeley

Co-Author: – University of California-Berkeley

Co-Author: – University of California Berkeley

Control of Power Electronic Converters

8:50 AM – 9:10 AM ET

T06.2 - Small-Signal Analysis and External Ramp Design for Multiphase Current-Mode Constant On-Time Control with Phase Overlapping

Location: Level Three, A313

Technical Lecture Presenter: – Virginia Polytechnic Institute and State University

Co-Author: – Virginia Polytechnic Institute and State University

Current-Mode and Voltage-Mode Control

9:10 AM – 9:30 AM ET

T06.3 - Multiphase Constant-on-Time Minimum-Deviation Controller for Modern Processors

Location: Level Three, A313

Technical Lecture Presenter: – University of Toronto

Co-Author: – University of Toronto

Co-Author: – Intel

Co-Author: – University of Toronto

Current-Mode and Voltage-Mode Control

9:30 AM – 9:50 AM ET

T06.4 - Closed-Loop Control of a Dual-Side Series/Parallel Piezoelectric-Resonator-Based DC-DC Converter

Location: Level Three, A313

Technical Lecture Presenter: – UCSD

Co-Author: – CEA LETI Univ. Grenoble Alpes, Grenoble, France

Co-Author: – UCSD

Control of Power Electronic Converters

9:50 AM – 10:10 AM ET

T06.5 - High-Bandwidth Embedded Rogowski Coil on Multilayer Substrate with Minimal Contribution to Power Loop Inductance

Location: Level Three, A313

Technical Lecture Presenter: – Graduate School of Natural Science and Technology Okayama University

Co-Author: – Okayama University

Sensor and Sensor-less Control

10:40 AM – 11:00 AM ET

T06.6 - Operating and Switching Frequency Circulating Current Control in Paralleled High Power Adjustable Speed Drives with Common DC Link

Location: Level Three, A313

Technical Lecture Presenter: – Eaton Corporation

Co-Author: – Zhejiang University

Control of Power Electronic Converters

11:00 AM – 11:20 AM ET

T06.7 - Mixed-Signal Sliding Mode Controller for Non-Inverting Buck-Boost Photovoltaic DC Optimizers

Location: Level Three, A313

Technical Lecture Presenter: – University of Colorado Boulder

Co-Author: – University of Colorado Boulder

Digital Control-MCUs, DSPs, FPGAs, ASICs

11:20 AM – 11:40 AM ET

T06.8 - A Current Sensorless Output Voltage Tracking Controller-Observer for a Boost Inverter using Feedback Linearization

Location: Level Three, A313

Technical Lecture Presenter: – Federal University of Santa Catarina

Co-Author: – Federal University of Santa Catarina

Co-Author: – Universidade Federal de Santa Catarina

Co-Author: – Federal University of Santa Catarina

Control of Power Electronic Converters

11:40 AM – 12:00 PM ET

T06.9 - Modeling and Control of a Cyclo-Active-Bridge Inverter for Single-Stage Three-Phase Grid Interface

Location: Level Three, A313

Technical Lecture Presenter: – Princeton University

Co-Author: – Princeton University

Co-Author: – ABB Corporate Research

Co-Author: – Princeton University

Control of Power Electronic Converters

8:30 AM – 12:00 PM ET

T07 - Modeling & Simulation I

Location: Level Three, A316

Technical Lecture Session Chair: – University of Québec at Trois-Rivières

Technical Lecture Session Chair: – Penn State

Student Session Assistant: – university of waikato

8:30 AM – 8:50 AM ET

T07.1 - Turn-On Transient Modeling of 10 kV SiC MOSFET Half-Bridge Power Module in LTspice

Location: Level Three, A316

Technical Lecture Presenter: – Aalborg University

Co-Author: – Aalborg University

Co-Author: – AAU Energy

Co-Author: – Aalborg University

Device and Component Modeling

8:50 AM – 9:10 AM ET

T07.2 - A Compact, Automated Sawyer-Tower System for Characterization of the High-Frequency, Soft-Switching Coss Loss of Wide Bandgap Devices

Location: Level Three, A316

Technical Lecture Presenter: – Stanford University

Co-Author: – Stanford University

Parasitics Extraction and Optimization

9:10 AM – 9:30 AM ET

T07.3 - Enhancing Behind-the-Meter Visibility of Grid Edge PV Systems and Electric Vehicle Charging Loads Through Integration of Compact Low-Cost Sensors

Location: Level Three, A316

Technical Lecture Presenter: – North Carolina State University

Co-Author: – North Carolina State University

Co-Author: – University of Pittsburgh

Hardware-in-the-Loop and Rapid Prototyping

9:30 AM – 9:50 AM ET

T07.4 - Supercapacitor based TMS Pulse Generator Design-Experimental Results Versus MATLAB MOSFET Simulation Model

Location: Level Three, A316

Technical Lecture Presenter: – university of waikato

Co-Author: – The University of Waikato

Co-Author: – University of Waikato

Device and Component Modeling

9:50 AM – 10:10 AM ET

T07.5 - Application of Artificial Intelligence for Modeling SiC Power MOSFETs

Location: Level Three, A316

Technical Lecture Presenter: – Macquarie University

Co-Author: – Macquarie University

Device and Component Modeling

10:40 AM – 11:00 AM ET

T07.6 - Multi-Objective Design Automation in Power Electronics using Bayesian Optimization Techniques

Location: Level Three, A316

Technical Lecture Presenter: – National Taiwan University of Science and Technology

Co-Author: – ECE-NTUST

Co-Author: – National Taiwan University of Science and Technology

Parasitics Extraction and Optimization

11:00 AM – 11:20 AM ET

T07.7 - Reduced Order Thermal Modelling of Multi-Chip Silicon Carbide Power Modules

Location: Level Three, A316

Technical Lecture Presenter: – Wolfspeed

Co-Author: – Wolfspeed

Device and Component Modeling

11:20 AM – 11:40 AM ET

T07.8 - Design and Evaluation of Dual-Resolver Emulation for Control System Verification in Aerospace Actuation Applications

Location: Level Three, A316

Technical Lecture Presenter: – Curtiss Wright Aerospace Actuation

Co-Author:

Co-Author: – Curtiss Wright

Hardware-in-the-Loop and Rapid Prototyping

11:40 AM – 12:00 PM ET

T07.9 - Un-Terminated Blackbox Modeling for Electric Machines

Location: Level Three, A316

Technical Lecture Presenter: – CPES/Virginia Tech

Co-Author: – Virginia polytechnic institute and state university

Co-Author: – CPES Virginia Tech

Co-Author: – Virginia Polytechnic Institute and State University

Circuits and Systems

8:30 AM – 12:00 PM ET

T08 - EV Charging Applications

Location: Level Three, A314

Technical Lecture Session Chair: – University of Dayton

Technical Lecture Session Chair: – Ontario Tech University

Student Session Assistant: – Nagoya Institute of Technology

8:30 AM – 8:50 AM ET

T08.1 - 7.2 kW GaN-Based DAB Converter with 37 kW/L Power Density and High Efficiency

Location: Level Three, A314

Technical Lecture Presenter: – Infineon Technologies Canada Inc

Co-Author: – Carleton University

Co-Author: – Infineon Technologies AG

Co-Author: – Infineon Technologies Canada Inc

Co-Author: – Carleton University, Dept. of Electronics.

On-board and Off-board Charging Systems

8:50 AM – 9:10 AM ET

T08.2 - A Novel Interleaving Method for High Power Integrated Electric Vehicle Charger with Three-Phase Permanent Magnet Synchronous Motor

Location: Level Three, A314

Technical Lecture Presenter: – Nissan Motor Co., Ltd.

Co-Author: – Nissan Motor Co., Ltd.

Co-Author: – Tokyo Denki University

Power Electronics for Hybrid and Electric Vehicles

9:10 AM – 9:30 AM ET

T08.3 - A Three-Phase CLLC Resonant Converter with Integrated Planar Magnetics for 22-kW On-Board Chargers

Location: Level Three, A314

Technical Lecture Presenter: – CPES / Virginia Tech

Co-Author: – Valeo

Co-Author: – Delta Electronics Americas Ltd.

Co-Author: – Virginia Polytechnic Institute and State University

Co-Author: – Virginia Tech Center for Power Electronics Systems

On-board and Off-board Charging Systems

9:30 AM – 9:50 AM ET

T08.4 - Reconfigurable LLC Resonant Converter for Wide Voltage Range and Reduced Voltage Stress in DC-Connected EV Charging Stations

Location: Level Three, A314

Technical Lecture Presenter: – KU Leuven

Co-Author: – KU Leuven - Energyville

Co-Author: – KU Leuven - EnergyVille

Co-Author: – Katholieke Universiteit Leuven - Energyville

Co-Author: – KU Leuven - EnergyVille

Power Electronics for Hybrid and Electric Vehicles

9:50 AM – 10:10 AM ET

T08.5 - Design and Control of GaN based Three-Phase / Single-Phase Combo Three-Level Flying Capacitor PFC for OBC Applications

Location: Level Three, A314

Technical Lecture Presenter: – Delta Electronics (Americas)

Co-Author: – Delta Electronics (Americas) Ltd.

Co-Author: – DELTA ELECTRONICS AMERICAS LTD.

Co-Author: – Delta Electronics Americas

Co-Author: – Delta Electronics

On-board and Off-board Charging Systems

10:40 AM – 11:00 AM ET

T08.6 - Optimization Strategy for Battery Electric Vehicle (BEV) DC Fast Charging (FC) in Cold Environments

Location: Level Three, A314

Technical Lecture Presenter: – University of Toronto

Co-Author: – University of Toronto

On-board and Off-board Charging Systems

11:00 AM – 11:20 AM ET

T08.7 - DC-Link Voltage Reduction with Synergetic Common-Mode Voltage Control of Single-Phase Two-Stage Non-Isolated EV Chargers

Location: Level Three, A314

Technical Lecture Presenter: – Seoul National University

Co-Author: – Seoul National University

On-board and Off-board Charging Systems

11:20 AM – 11:40 AM ET

T08.8 - DC-DC Converter Architecture for Fast Electric Vehicle (EV) Battery Charging Applications

Location: Level Three, A314

Technical Lecture Presenter: – Queens University

Co-Author: – Queens University

Co-Author: – Queen's University

On-board and Off-board Charging Systems

11:40 AM – 12:00 PM ET

T08.9 - Fast Simulator for the Estimation of Inverter DC-Link Temperature in e-Drives Subjected to Highly Variable Working Cycles

Location: Level Three, A314

Technical Lecture Presenter: – Politecnico di Torino

Co-Author: – Politecnico di Torino

Power Electronics for Hybrid and Electric Vehicles

9:00 AM – 10:30 AM ET

TC 11: Aerospace Power

Location: Omni Hotel, Level M4, Grand C

IEEE PELS Meetings

9:00 AM – 10:30 AM ET

TC 4: Electrified Transportation Systems

Location: Omni Hotel, Level M4, Grand E

IEEE PELS Meetings

9:00 AM – 4:30 PM ET

Expo Hall Open

Location: Level One, Hall A1/A2

9:30 AM – 11:00 AM ET

WIE Committee Meeting

Location: Omni Hotel, Level M4, Grand A

IEEE PELS Meetings

10:00 AM – 12:00 PM ET

Power Technology Roadmap (PTR) Committee

Location: Omni Hotel, Level M2, International B

PSMA Meetings

10:00 AM – 4:00 PM ET

Tuesday Tours

10:10 AM – 10:40 AM ET

Break

11:00 AM – 12:00 PM ET

ECCE Europe Steering Committee

Location: Omni Hotel, Level M4, Grand C

IEEE PELS Meetings

11:00 AM – 12:00 PM ET

TPEL 40th Anniversary Planning Committee

Location: Omni Hotel, Level M4, Grand E

IEEE PELS Meetings

11:00 AM – 12:30 PM ET

TC 9: Wireless Power Transfer Systems

Location: Omni Hotel, Level M4, Grand A

IEEE PELS Meetings

11:00 AM – 1:00 PM ET

Standards Committee Meeting Industy Committee Meeting VP of Industry and Standards Meeting

Location: Omni Hotel, Level M4, Grand B

IEEE PELS Meetings

12:00 PM – 1:30 PM ET

Lunch in the Expo Hall

Location: Level One, Hall A1/A2

12:00 PM – 2:00 PM ET

Magnetics Committee

Location: Omni Hotel, Level M2, International B

PSMA Meetings

12:00 PM – 2:00 PM ET

Semiconductor Committee

Location: Omni Hotel, Level M2, International C

PSMA Meetings

12:00 PM – 2:30 PM ET

VP Global Intersociety Relations Education & Digital Media Scholarship & Fellowship Committee

Location: Omni Hotel, Level M4, Grand C

IEEE PELS Meetings

12:00 PM – 3:00 PM ET

Digital Media Recording Room

Location: Omni Hotel, Level M4, Grand E

IEEE PELS Meetings

12:30 PM – 2:00 PM ET

TC 2: Power Components, Integration, and Power Ics

Location: Omni Hotel, Level M4, Grand A

IEEE PELS Meetings

1:00 PM – 2:00 PM ET

PEDG Steering Committee

Location: Omni Hotel, Level M4, Grand B

IEEE PELS Meetings

1:30 PM – 2:00 PM ET

EX - 48V Architecture for Automotive

Location: Expo Theater 2

Exhibitor Presenter: – STMicroelectronics

Presented By

1:30 PM – 2:00 PM ET

EX - A State-of-the-art Heterogeneous Core Design to Further Boost Your Power Density

Location: Level Three, A313

Exhibitor Presenter: – ACME Electronics

Presented By

1:30 PM – 2:00 PM ET

EX - AmberSemi

Location: Level Three, A316

1:30 PM – 2:00 PM ET

EX - Delivering breakthrough performance at real-world conditions

Location: Expo Theater 4

Exhibitor Presenter: – Wolfspeed

Presented By

1:30 PM – 2:00 PM ET

EX - High Efficiency Transformer-coupled VR Solution for AI Chips

Location: Level Three, A311

Exhibitor Presenter: – Delta Electronics

1:30 PM – 2:00 PM ET

EX - Materials Technology for Flux-Free Soldering Applications in Power Electronics

Location: Level Three, A312

Exhibitor Presenter: – Indium Corporation

Presented By

1:30 PM – 2:00 PM ET

EX - Multi-Phase Controller and Power Stage for AI Server and Graphic Card Power

Location: Level Three, A314

Exhibitor Presenter: – Alpha & Omega

Presented By

1:30 PM – 2:00 PM ET

EX - Nanocrystalline Soft Magnetic Alloy Powder Produced by SWAP

Location: Level Three, A315

Exhibitor Presenter:

Presented By

1:30 PM – 2:00 PM ET

EX - Powering Innovation: The Next Generation of 650 V CoolMOS ™ 8, 750 V CoolSiC™ G2 and Top Side Cooling Q-DPAK technology

Location: Expo Theater 3

Exhibitor Presenter: – Infineon

Presented By

1:30 PM – 2:00 PM ET

EX - Understanding EMI and Noise Mitigation Methods

Location: Expo Theater 1

Exhibitor Presenter: – Wurth Elektronik

Presented By

1:30 PM – 5:00 PM ET

Advanced Energy

Location: Level One, Hall A3

Table Host: – Advanced Energy Industries

Student Job Fair

1:30 PM – 5:00 PM ET

Aegis Power Systems, Inc.

Location: Level One, Hall A3

Table Host: – Aegis Power Systems, Inc.

Student Job Fair

1:30 PM – 5:00 PM ET

Delta Electronics (Americas) Ltd.

Location: Level One, Hall A3

Table Host: – Delta Electronics

Student Job Fair

1:30 PM – 5:00 PM ET

FranklinWH Energy Storage Inc.

Table Host: – FranklinWH Energy Storage Inc.

Student Job Fair

1:30 PM – 5:00 PM ET

MKS Instruments

Location: Level One, Hall A3

Table Host: – MKS Instruments

Student Job Fair

1:30 PM – 5:00 PM ET

Monolithic Power Systems (MPS)

Location: Level One, Hall A3

Table Host: – Monolithic Power Systems (MPS)

Student Job Fair

1:30 PM – 5:00 PM ET

Simplis Technologies

Location: Level One, Hall A3

Table Host: – SIMPLIS Technologies

Student Job Fair

1:30 PM – 5:00 PM ET

SpaceX

Table Host: – SpaceX

Student Job Fair

1:30 PM – 5:00 PM ET

STMicroelectronics, Inc.

Location: Level One, Hall A3

Table Host: – STMicroelectronics

Student Job Fair

1:30 PM – 5:00 PM ET

The Aerospace Corporation

Location: Level One, Hall A3

Table Host: – The Aerospace Corporation

Student Job Fair

1:30 PM – 5:00 PM ET

Tyndall National Institute

Location: Level One, Hall A3

Table Host: – Tyndall National Institute

Student Job Fair

2:00 PM – 3:30 PM ET

TC 5: Sustainable Energy Systems

Location: Omni Hotel, Level M4, Grand B

IEEE PELS Meetings

2:00 PM – 3:30 PM ET

TC 6: Emerging Power Electronic Technologies

Location: Omni Hotel, Level M4, Grand A

IEEE PELS Meetings

2:00 PM – 4:00 PM ET

Energy Storage/Energy Management/Energy Harvesting Committee

Location: Omni Hotel, Level M2, International B

PSMA Meetings

2:15 PM – 2:45 PM ET

EX - Accurate High-Fidelity Precision Testing Solutions for Tomorrow’s Power Systems and Power Integrity Applications

Location: Level Three, A315

Exhibitor Presenter: – www.picotest.com

Presented By

2:15 PM – 2:45 PM ET

EX - Advancing Power Solutions Using TLVR with High-Current Multiphase Dual Inductors

Location: Expo Theater 2

Exhibitor Presenter: – Wurth Elektronik

Presented By

2:15 PM – 2:45 PM ET

EX - Cost-Effective, Highly-Efficient Power Delivery Across the Load Range

Location: Expo Theater 1

Exhibitor Presenter:

Presented By

2:15 PM – 2:45 PM ET

EX - Designing Low Loss Inductors with Next-Generation Powder Core Materials

Location: Level Three, A311

Exhibitor Presenter: – Mag Inc

Presented By

2:15 PM – 2:45 PM ET

EX - Expanding the LV100 lineup to include 3.3kV SiC SBD-Embedded MOSFETs (Unifull™) and other next generation technologies

Location: Expo Theater 4

Exhibitor Presenter: – Mitsubishi Electric US Inc.

Presented By

2:15 PM – 2:45 PM ET

EX - GaN-based Solutions for Auxiliary Power Supplies and Battery Chargers

Location: Level Three, A316

Exhibitor Presenter: – STMicroelectronics

2:15 PM – 2:45 PM ET

EX - MCU-Driven GaNevo: Simplifying Power Module

Location: Level Three, A313

Exhibitor Presenter: – Chip-GaN Semiconductor

Presented By

2:15 PM – 2:45 PM ET

EX - Perpetuum Mobile – OR Pushing The Efficiency & Power Density Limits of Low-Power Flyback Converters

Location: Expo Theater 3

Exhibitor Presenter: – Texas Instruments

Presented By

2:15 PM – 2:45 PM ET

EX - Simulating the Conducted EMI Performance of a Switching Power Supply

Location: Level Three, A312

Exhibitor Presenter: – SIMPLIS Technologies

Presented By

2:15 PM – 2:45 PM ET

EX - Testing Solutions for AI Server Power and BBU

Location: Level Three, A314

Exhibitor Presenter: – Chroma

Presented By

2:30 PM – 3:30 PM ET

Nominations Committee (Members Only)

Location: Omni Hotel, Level M4, Grand C

IEEE PELS Meetings

2:45 PM – 3:00 PM ET

Break

3:00 PM – 3:30 PM ET

EX - Advancing Power Electronics with Nexperia’s 650 V IGBT technology: High Efficiency Solutions for Industrial and Automotive Applications

Location: Expo Theater 4

Exhibitor Presenter: – Nexperia

Presented By

3:00 PM – 3:30 PM ET

EX - Automotive Grade 650V GaN Devices

Location: Level Three, A313

Exhibitor Presenter: – ROHM Semiconductor USA, LLC

Presented By

3:00 PM – 3:30 PM ET

EX - Better than BOPP: Unlocking higher temperatures with low loss in nanolayered polymer capacitor films

Location: Level Three, A314

Exhibitor Presenter: – Peak Nano Films

Presented By

3:00 PM – 3:30 PM ET

EX - Comprehensive Power Delivery Solution for Modern AI Data Centers

Location: Expo Theater 1

Exhibitor Presenter: – STMicroelectronics

Presented By

3:00 PM – 3:30 PM ET

EX - Faster than Realtime Power Converter & Motor Drive System Simulations with Trained Physics Models for System Cost Optimization

Location: Level Three, A311

Exhibitor Presenter: – Altair Engineering

Presented By

3:00 PM – 3:30 PM ET

EX - Simplifying Loss Simulations Using a Self-Service PLECS Model Generator

Location: Expo Theater 3

Exhibitor Presenter: – onsemi

Presented By

3:00 PM – 3:30 PM ET

EX - Smarter, Smaller, Simpler: Advanced IC Innovations that Streamline Designs for Power Systems

Location: Expo Theater 2

Exhibitor Presenter: – Nisshinbo Micro Devices

Presented By

3:00 PM – 3:30 PM ET

EX - Soitec’s Power-SOI Based Gate Drivers Shaping the Future of Wide-bandgap (WBG) Devices for High Switching Frequency Power Conversion Applications

Location: Level Three, A312

Exhibitor Presenter: – Soitec

Presented By

3:30 PM – 5:00 PM ET

Region 1-3 Chapter Chairs

Location: Omni Hotel, Level M4, Grand C

IEEE PELS Meetings

3:30 PM – 5:00 PM ET

TC 10: Design Methodologies

Location: Omni Hotel, Level M4, Grand B

IEEE PELS Meetings

3:45 PM – 4:15 PM ET

EX - 2kV SiC Drives Electrification Through Speed and Simplicity

Location: Level Three, A311

Exhibitor Presenter: – Semikron Danfoss

Presented By

3:45 PM – 4:15 PM ET

EX - Advances in SiC MOSFET device and packaging technology from ROHM

Location: Expo Theater 2

Exhibitor Presenter: – ROHM Semiconductor USA, LLC

Presented By

3:45 PM – 4:15 PM ET

EX - AmberSemi -the Generational Power Architectures Paradigm shift: Bringing unique digital power solutions to the market that solve the entire power ecosystem challenge.

Location: Expo Theater 1

Exhibitor Presenter: – Amber Semiconductor, Inc. (AmberSemi)

Presented By

3:45 PM – 4:15 PM ET

EX - Industry First - 3 & 4-level, Buck Converter for Fast Charging

Location: Expo Theater 4

Exhibitor Presenter: – pSemi Murata

Presented By

3:45 PM – 4:15 PM ET

EX - Next-Generation SiC Power MOSFETs for Automotive Applications

Location: Level Three, A312

Exhibitor Presenter: – Robert Bosch GmbH

Presented By

3:45 PM – 4:15 PM ET

EX - Reliability of HTV150A Films for High Temperature and High Voltage Capacitors for AC-DC Inverter Applications

Location: Level Three, A314

Exhibitor Presenter: – SABIC

Presented By

3:45 PM – 4:15 PM ET

EX - Texas Instruments

Location: Level Three, A315

3:45 PM – 4:15 PM ET

EX - The Cleverscope CS1202 Isolated Transistor Digitizer

Location: Level Three, A313

Exhibitor Presenter: – Cleverscope

Presented By

3:45 PM – 4:15 PM ET

EX - West Coast Magnetics

Location: Expo Theater 3

4:15 PM ET

Expo Hall Raffle Drawing in APEC Hub

Location: Level One, Hall A1/A2

4:30 PM – 6:00 PM ET

Debate 1 - Magnetics vs Capacitors - Which presents the lesser obstacle to advancing power electronics?

Location: Level Four, A412

Session Chair: – Wurth Elektronik

Debate Speaker: – Payton Planar

Debate Speaker: – Dartmouth

Debate Speaker: – YAGEO Group

Debate Speaker: – MaxEpic Inc.

4:30 PM – 6:00 PM ET

Debate 2 - SiC vs GaN - Which will lead in Power Conversions?

Location: Level Four, A411

Session Chair: – AspenCore Power Electronics News

Debate Speaker: – Microchip Technology

Debate Speaker: – Efficient Power Conversion

Debate Speaker: – onsemi

Debate Speaker: – Infineon

4:30 PM – 6:00 PM ET

Debate 3 - The power or peril of AI-driven designs - Will they light up the power supply landscape or will they go up in flames?

Location: Level Four, A404/A405

Session Chair: – University of California at Berkeley

Debate Speaker: – Magna-Power Electronics Inc.

Debate Speaker: – University of Texas at Dallas

Debate Speaker: – University of Colorado Boulder

Debate Speaker: – Texas Instruments

6:30 PM – 8:30 PM ET

PELS Mentorship Roundtables (Registration Required)

Location: Omni Hotel, Level M4, Grand E

IEEE PELS Meetings