IS04 - 3D-Power Packaging for AI and Vehicles

Tuesday, March 18, 2025

8:30 AM – 11:55 AM ET

Location: Level Four, A402

Industry Session Chair(s)

8:30 AM – 8:55 AM ET

Off-Road Vehicles' Power Electronics - Packaging and Thermal Management
Industry Session Presenter: Brij N. Singh, PhD (he/him/his) – John Deere
8:55 AM – 9:20 AM ET

Modern power conversion enabled by WGB semiconductors and innovative package solutions
Industry Session Presenter: Peter Friedrichs, PhD (he/him/his) – Infineon Technologies AG
9:20 AM – 9:45 AM ET

PowerSiP packaging for AI/datacenter applications
Industry Session Presenter: Vikas Gupta, PhD – ASE, USA
9:45 AM – 10:10 AM ET

Power Technology Report on Embedded and Integrated Magnetics
Industry Session Presenter: Ranajit Sai – Tyndall National Institute
10:40 AM – 11:05 AM ET

Advanced Package of Power Modules for AI
Industry Session Presenter: Ian Chan (he/him/his) – Cyntec Co. Ltd., Taiwan
11:05 AM – 11:30 AM ET

A packaging solution for powering AI processors
Industry Session Presenter: Joseph Meyer – Ferric Inc., USA
11:30 AM – 11:55 AM ET

Integrated GaN & Passive Modules by Panel Level Manufacturing for AI data centers
Industry Session Presenter: Yoshiaki Aizawa, ME (he/him/his) – AOI Electronics, Japan