In this paper, a novel 3D power module structure based on direct dielectric liquid cooling is proposed for high voltage applications. This structure allows modular assembly and puts an end to the ever-existing compromise between high electrical insulation and high thermal performance, which usually requires a trade-off in the thickness of the ceramic layer. This proposed power module assembly is illustrated and then evaluated through electromagnetic and transient electric field simulations, using Ansys Q3D Extractor and Comsol®Multiphysics respectively. Stray inductance measurements are carried out using a precision impedance analyzer. Finally, direct current (DC) breakdown voltage measurements are conducted on the dielectric liquid alone and on the structure, submerged in the liquid, in order to evaluate its voltage withstand capability.
.jpg "Omar Sanjakdar (he/him/his) photo")
