Thermal management plays a critical role in the performance of the power electronic converters. Immersion cooling, as a novel promising thermal management solution for power electronics, can significantly improve the efficiency, power density, and reliability of power converters. In this digest, based on the simulation and preliminary experimental investigations, the efficiency improvement of an immersion cooled Silicon Carbide (SiC) 3-level T-type inverter is characterized in comparison to the scenario based on conventional cooling solution with heatsinks and fans. It shows that the peak efficiency of the immersion cooled 50-kW 3-level T-type SiC inverter can be improved by up to 0.14%, and the semiconductor hotspot temperature is significantly reduced.
.jpg "Yiju Wang photo")