T37.2 - Discrete Power Device Packaging with Integrated Direct Two-Phase Cooling

Thursday, March 20, 2025

10:30 AM – 10:50 AM ET

Location: Level Three, A301

Technical Lecture Presenter(s)

Jinpeng Cheng, PhD (he/him/his)

Chongqing University

Presentation Paper

Co-Author(s)

JW

Jinxiao Wei

Chongqing-Warwick Joint Laboratory in Silicon Carbide Power Electronics
HF

Hao Feng

Chongqing University
LR

Li Ran

Chongqing-Warwick Joint Laboratory in Silicon Carbide Power Electronics

This paper presents a discrete device packaging with integrated direct cooling. Firstly, the fabricated three-section heat pipe meets the common 650V, 1200V and 1700V devices in terms of electrical insulation, while exhibiting thermal performance comparable to commercial heat pipes. This validates the feasibility of the proposed discrete device packaging. Secondly, the proposed discrete device was fabricated, and experimental results show that it has excellent thermal performance, with a temperature difference of less than 1.5°C between the evaporator and the condenser. The design is expected to be widely used in high power density converters.