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Technical Lecture

Embedded Technologies, 3D Packaging, and

T28.4 - Planar Rogowski Coil-Based Switch Current Measurement for a 1.2 kV SiC MOSFET Embedded Die PCB

Thursday, March 20, 2025
9:00 AM – 9:20 AM ET
Location: Level Three, A312
This paper introduces the integration of a small-footprint, planar Rogowski coil into an 1.2 kV embedded die PCB for the switch transient current measurement thereof. Due to the high-density integration of embedded die PCBs, the switch transient current measurement has been a challenge. The planar Rogowski coil enables the current measurement with a small impact on the commutation loop design and parasitic stray inductance. The 106 mm^2 small coil geometry increases the commutation loop stray inductance by 399 pH. The 185 MHz bandwidth current sensor allows measuring the fast switch transient currents of the 1.2 kV SiC MOSFETs. Design recommendations are explored. Double pulse tests are carried out at a dc-bus voltage of 850 V and a drain current of 140 A. The switch transient current and turn-on and turn-off switch transient energy loss will be included in the final paper.