Power electronics modules experience thermomechanical stress during operation, primarily due to the rigid connection of various material layers with different coefficients of thermal expansion (CTE). This issue is particularly critical for silicon carbide (SiC) power modules because of the notably high Young’s Modulus of SiC crystals. To address this challenge, this paper demonstrates the integration of a liquid metal (LM) based SiC packaging design into a half-bridge power module with gate drivers and water cooling. The LM-based package features a floating die structure and liquid metal (LM) fluidic connections. The proposed LM package based half-bridge exhibits lower thermal stress and warpage during operation, suggesting higher reliability and a longer lifetime. Experimental testing on half-bridge prototypes validates the uncompromised performance of using a based SiC package.
