Jaber Abu Qahouq, PhD
The University of Alabama (UA)
Technical Dialogue Presenter: Xi Chen, M.E. (he/him/his) – Tianjin University
Co-Author: Jiazheng Zhang – Tianjin University
Co-Author: Mingjun Bao – Tianjin University
Technical Dialogue Presenter: Teng Wu, PhD – Schneider Electric
Co-Author: Hong Liu – Schneider Electric
Technical Dialogue Presenter: Alessandro Bertolini (he/him/his) – STMicroelectronics
Co-Author: Claudio Luise – R&D
Co-Author: Alberto Cattani (he/him/his) – STMicroelectronics
Co-Author: Alessandro Gasparini – R&D
Technical Dialogue Presenter: Apparao Dekka – Lakehead University
Co-Author: Hoang Le (he/him/his) – Lakehead University
Co-Author: Deepak Ronanki, PhD (he/him/his) – Indian Institute of Technology Madras
Co-Author: Abdul Beig – Khalifa University
Technical Dialogue Presenter: Eiji Hiraki (he/him/his) – Okayama University
Co-Author: Yuto Yoshimura – okayama university
Co-Author: Akito Nakagaki – Okayama University
Co-Author: Kazuhiro Umetani, PhD (he/him/his) – Okayama University
Co-Author: Masataka Ishihara – Okayama University
Co-Author: Zaitsu Toshiyuki – ROHM Co.,Ltd
Co-Author: Kenji Funatani, MA – ROHM Co.,Ltd
Technical Dialogue Presenter: Teng Wu, PhD – Schneider Electric
Co-Author: Zhenguo Huo (he/him/his) – Schneider Electric
Co-Author: Shangxian Ning – Schneider Electric
Technical Dialogue Presenter: Paolo Sbabo (he/him/his) – University of Padova
Co-Author: Paolo Mattavelli, PhD – University of Padova
Co-Author: Andrea Petucco – University of Padova
Co-Author: Giorgio Spiazzi – University of Padova
Technical Dialogue Presenter: Xuliang Wang (he/him/his) – Tsinghua University
Co-Author: Haoyu Wang – Tsinghua University
Co-Author: Yang Liu – The Hong Kong University of Science and Technology
Co-Author: Yunxin Wang – Tsinghua University
Co-Author: Boran Zhang – Tsinghua University
Co-Author: Hongru Liu – Tsinghua University
Co-Author: Yan Wang – Tsinghua University
Co-Author: Xiaosen Liu – Tsinghua University