Jerry Hudgins

University of Nebraska-Lincoln

Presentation(s):

• T37.5 - A Scalable Dual-Orthogonal-Cooling Packaging Concept for Parallel-Series SiC Chips

  Thursday, March 20, 2025
  11:30 AM – 11:50 AM ET

• D17.6 - A Physics-Based Temperature Dependent Analytical Model for 2DEG Density in AlGaN/GaN HEMT Devices

  Thursday, March 20, 2025
  11:30 AM – 1:30 PM ET