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Technical Dialogue

GaN and SiC Devices and Modules

D07.2 - A Dynamic Current Sharing Method using Novel Clip Considering Mutual Inductance Coupling

Thursday, March 20, 2025
11:30 AM – 1:30 PM ET
Location: Level One, Hall A3
Imbalanced parasitic parameters can cause uneven dynamic currents among parallel chips, leading to uneven losses and junction temperatures, which in turn affect system lifetime. In addition, clip bonding is a low thermal resistance and highly reliable packaging method. Therefore, this paper proposes a novel clip to optimize the dynamic current sharing performance. The positions of the proposed clip's pins can be changed to adjust imbalanced self-inductances and mutual inductances within the power module. A design method for the positions of the pins is presented. Based on ANSYS Q3D, the optimized clip can be effectively designed with the maximum allowable value. Compared to existing methods, the proposed method considers the unbalanced mutual inductances and does not require changing the chip layout. Simulation results validate the effectiveness of the proposed clip. Finally, two half-bridge power modules were fabricated, and double pulse tests were conducted to further verify the proposed method.